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Blog Review: January 19

Memory design challenges; 3D packaging; Multiphysics PCB; keyword tracking.

Synopsis’ Anand Thiruvengadam examines memory chip design challenges to optimize PPA, speed up turnaround times, and improve reliability and how a left-shift approach can help.

Cadences Paul McLellan looks at some of TSMC’s recent updates in 3D packaging and the importance of thermal analysis and finding the right balance between using IR drop and TSV in multi-chip physical verification.

Siemens Katie Tormala tests an approach to simulate multiphysics phenomena on the PCB by considering all networks with the maximum level of detail, without the need to convert the EDA data into a CAD model.

Arms Axel Berg examines on-device keyword detection for voice assistants through the use of Transformer networks, which provide both the accuracy and latency needed.

Ansys’ Jennifer Procario checks how thermal simulation is used to help design a system that uses high temperature solar heat to convert CO2 and water into synthetic fuels, such as solar gasoline, diesel or jet fuel, which are compatible with internal combustion engines and conventional turbine aircraft.

In a blog for SEMI, Pierre Gillespie from Advanced Energy looks at the evolution of plasma process power and why it’s time to rethink how power is managed in plasma-based applications.

Applied materials’ Sundeep Bajikar finds that the industry is changing, with demand and investment in semiconductor manufacturing increasingly spread across major nodes and those focused on IoT, communications, automotive, energy and sensors .

NXP Konrad Lorentz designates the battery junction box as a key part of an electric vehicle’s battery management system, allowing it to measure and record the total battery voltage and the current flowing in and out of the battery and allowing a precise calculation of its state of charge.

Plus, be sure to check out the blogs featured in the latest Low Power-High Performance newsletter:

Mark Eslinger and Jin Hou of Siemens EDA present a step-by-step method for refining formal verification results.

Synopsys’ Jerry Lotto takes a fresh look at the evolution of Ethernet, from supporting home networks to enabling hyperscale and cloud data centers.

Arm’s Chris Shore examines network digitization and its impact on the semiconductor industry.

Rambus’ Tim Messegee finds that some of the most fundamental changes in the PCIe 6.0 standard increase signaling rates.

Ansys’ Ronak Shah shows how multiphysics simulation is helping shape power conversion solutions for the electricity transmission grid of the future.

Cadence’s Paul McLellan weighs in on the hybrid version at this year’s consumer electronics event.

Jesse Allen

Jesse Allen

(All posts)

Jesse Allen is a Knowledge Center Administrator and Editor at Semiconductor Engineering.