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Blog Review: February 16

Software side of the Morello project; low power for IoT; supply chain challenges.

Arms Marc Nicholson explains the software side of the Morello project to implement a security-centric architecture prototype, presenting a high-level view of the software stacks and discussing the status and roadmap of a range of activities.

Synopsis’ Ron Lowman finds that as IoT technology and wearable device capabilities grow, the deployment of 5G networks and interest in AI and automation will require teams to invest in SoC design and optimization techniques improved, with a priority on low power consumption and increased battery life.

Siemens Oren Manor highlights key challenges ahead for the electronics industry, including continued supply chain disruption, global travel limitations, and increased demand from the automotive industry.

Cadences Ben Gu finds that mesh generation is essential for accurate and efficient computer simulation, but mesh generation for complex multi-physics problems is a difficult undertaking.

Ansys’ Prith Banerjee examines how AI can dramatically increase simulation speed and notes trends such as the importance of good training data, generative AI, and the use of the cloud for collaborative work.

The ESD Alliance Bob Smith discusses with Azeez Bhavnagarwala of Metis Microsystems energy harvesting from transient data to improve component performance while reducing total power consumption, resulting in reductions in energy-delay product of logic and CMOS memory components .

Search Semico Rich Wawrzyniak examines the implications of Intel’s recent announcements regarding the RISC-V architecture and ecosystem on the foundry, EDA, SoC, and SiP markets.

memory analyst Jim practices examines the impact that the recent contamination issue at Western Digital and Kioxia flash wafer manufacturing plants could have on the affected companies and on the flash market as a whole.

from Intel Rao Desineni and Eugene Tuv highlight the many applications of AI the company is deploying in its manufacturing environment and why there is still room to grow.

Nvidia Isha Salian examines how researchers are adapting sensors and computer vision technology from the automotive field for use in healthcare settings to reduce medical errors and improve monitoring of patient movement and recovery.

And don’t miss the blogs featured in the latest Low Power-High Performance newsletter:

Arm’s Panch Chandrasekaran examines what will drive 5G adoption.

Fraunhofer’s Dirk Mayer and Ulf Wetzker examine where to get enough data to train useful AI models for industrial processes.

Neel Natekar from Siemens offers a different approach to ESD verification.

Geetha Rangarajan of Synopsys sheds light on AI-driven design that benefits projects on mature nodes.

Frank Ferro of Rambus shows how the latest version of the High Bandwidth Memory standard adapts to increasingly demanding applications.

Ansys’ John Lee observes that systems companies are betting on optimized, custom-built silicon to maintain their competitive advantage.

Cadence’s Veena Parthan explains how computer simulation of fluids helps design super-fast boats.

ESD Alliance’s Bob Smith highlights key innovations that have helped shape the semiconductor industry.

Jesse Allen

Jesse Allen

(All posts)

Jesse Allen is a Knowledge Center Administrator and Editor at Semiconductor Engineering.