Importance of packaging design to grow; 3D thermal challenges; SmartNIC; ALD for quantum.
Siemens Keith Felton expects next year to see more emphasis on several areas of semiconductor package design, including the accelerated growth of heterogeneous integration, multi-chip and SiP chips, the emergence and adoption of organic-based interposers and early detection of thermal and electromechanical problems.
Cadences Paul McLellan visits Imec to learn more about removing heat from 3D packages, upcoming developments in CMOS over the next ten years, and some of the biggest challenges in memories.
Synopsis’ Rita Horner verifies how smart network interface cards, or SmartNICs, support emerging trends in data center infrastructure by offloading various routine tasks to free up host server processors to focus on data processing functions basic apps.
Renesas Lior Weiss explains how Target Wake Time in Wi-Fi 6/6E can reduce power consumption and improve spectral efficiency by allowing devices to negotiate when and how often they will wake up to send or receive data.
Ansys’ Tim Paluca talks with Bernt Øivind Børnich of Halodi Robotics about designing robots that use smooth, conforming motions to safely interact with humans in applications such as physical security, retail, and healthcare.
Arms Robert Ianello highlights a new online course to teach skills such as communication, critical thinking and problem solving to people working at the intersection between technology, product innovation and business.
The ESD Alliance Bob Smith talks with Excellicon’s Rick Eram about chip design trends and complexity, the verification market, and ways for designers to compare the physical floor plan with RTL code and timing constraints.
Eindhoven University of Technology Silk Peeters details a new project to apply atomic layer deposition and etching to large-scale fabrication of quantum technologies and investigate how atomic-scale processing methods could minimize losses and reduce error rates in quantum computing devices.
Nvidia Alex McCaskey introduces the Quantum Optimized Device Architecture (QODA) programming model for quantum-classical hybrid computing that aims to accelerate the research and development of hybrid algorithms through industry-standard interoperability with GPU processing and circuit simulation that extends from laptops to distributed multi-node and multi-GPU architectures.
from Amazon Matthew Campagna shows how the company is participating in the quantum cryptography standardization process and developing new public-key algorithms that can withstand quantum hardware attacks that can break current security methods.
And don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:
Amkor’s Tyler DeHaan seeks to communicate what goes on inside a package through illustrations.
David Haynes, Daniel Shin, and Lidia Vereen of Lam Research explore how RF filters for Wi-Fi 6 and 5G devices enable in-band signal separation and critical steps in RF filter manufacturing.
SEMI’s Cassandra Melvin covers a range of presentations from solving supply chain disruptions to using AI to improve sustainability to the importance of expanding the talent pool.
Tom Brown of Brewer Science highlights the challenges of mixed remote and office work environments.
Jesse Allen is a Knowledge Center Administrator and Editor at Semiconductor Engineering.