cryogenic CMOS; dynamic voltage drop; route to 224G SerDes; advanced computing.
Coventor’s Michael Hargrove highlights the need for a new generation of deep submicron CMOS circuits that can operate at deep cryogenic temperatures to achieve a quantum integrated circuit where the qubit array is integrated on the same chip as the CMOS electronics needed to read the qubit state .
Ansys’ Marc Swinnen warns of dynamic voltage drops as ultra-low supply voltages, tighter-coupled cells, and sensitive transistors become more common, and the inability of modern flow designs to completely eliminate this threat. Paul McLellan examines the road to 224G SerDes, including the current state of the standard definition process, a new candidate for modulation, and the challenges of the analog front-end, ADC, DSP, and PLL.
Synopsis’ Ron Lowman explores the different types of edge computing segments and finds that the convergence of edge computing and AI is poised to reshape traditional IT processes and pave the way for new applications and services in coming years.
Siemens Katie Tormala examines how to take advantage of a parallel PCB thermal design approach for faster design closure and points to dozens of ways to streamline PCB thermal design.
Arm Ashok Bhat takes into account the environmental impact of training AI models and steps can be taken to minimize the carbon impact, such as careful placement of workloads, consideration of energy sources, and consideration of awareness of embedded emissions.
In a blog for SEMI, Okmetic’s Petri Santala shares highlights from the recent MEMS and Sensors Technical Congress, including some of the latest advances in MEMS and sensors in markets ranging from displays to biotechnology and in key areas of MEMS manufacturing.
from Intel Gadi Singer explores how the knowledge constructs that allow an AI system to organize its worldview, understand meaning, and demonstrate its understanding of events and tasks are likely to be key to transforming AI from surface correlation to understanding the world and digging into the dimensions of knowledge that support higher intelligence.
A Rambus The writer explains how over-the-air programming, or OTA, is used to automatically update firmware, software, and encryption keys in automotive systems and some of the security challenges that must be overcome.
Nvidia Dong Yi introduces a framework for training conversational AI models using synthetic data created by transformer models that can be used as a valid surrogate for real data in machine learning algorithms to protect user privacy while making accurate predictions.
Plus, check out the blogs featured in the latest Manufacturing, Packaging, and Materials newsletter:
Coventor’s Gerold Schröpfer draws on ideas from early computing to reduce energy consumption.
Amkor’s Prasad Dhond examines why defect reduction is becoming more important as the number of chips in cars continues to rise.
Jan Willis of eBeam Initiative presents a discussion with Mike Hermes of Micron on the major changes in photomask technology and the challenges EUV poses for the mask store.
David Haynes of Lam Research finds that 5G isn’t the only wireless revolution underway.
Jessica Albright of Brewer Science explains the importance of monitoring and reporting on different classes of emissions.
Serena Brischetto from SEMI presents an upcoming keynote from Luc Van den hove from Imec, who suggests looking beyond the PPA to consider a device’s environmental footprint.
QP Technologies’ Rosie Medina suggests how to achieve high levels of functionality and robustness in a compact format.
Jesse Allen is a Knowledge Center Administrator and Editor at Semiconductor Engineering.