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Blog Review: September 21

FP8 for AI; very short range connectivity; hot chiplets; medical device requirements.

Arms Neil Burgess and Sangwon Ha explain why they joined Intel and Nvidia in coming up with a new 8-bit floating-point specification to allow neural network models developed on one platform to be run on other platforms without encountering the overhead of having to convert the large amounts of model data between formats while minimizing wasted jobs.

Synopsis’ Manuel Mota examines Very Short Range (VSR) connectivity, including trends driving transformation in the data center, specific use cases, and breaking existing copper module reach limits.

Cadences Paul McLellan shares highlights of recent Hot Chips, highlighting some of the latest technology to put more than one die in a package.

Siemens Scott Morrisson reviews the history of the FDA and the role it could play in the future of the requirements imposed on manufacturers of medical devices, particularly in terms of software.

Rambus’ Philippe Legros discusses how Single Root I/O Virtualization (SR-IOV) can facilitate the implementation of virtualization in PCIe systems by allowing multiple virtual machines to share PCI hardware resources in a cost-effective manner.

Renesas Ricardo Vincelli provides a basic introduction to the evolution of some of the functional safety standards for automotive products, including how and why they were introduced.

Ansys’ Susan Coleman examines how metamaterials can allow manufacturers to integrate various physical functions such as vibration, acoustics, heat conduction, deformation and weight reduction into their products.

The ESD Alliance Bob Smith discusses FPGA prototyping market trends with Ying Chen of S2C, including left-hand sieving and the use of AI/ML for partitioning.

Plus, check out the latest blogs, including those from the Manufacturing, Packaging & Materials newsletter:

Amkor’s Nathan Whitchurch examines the unique challenges of complex packages and why they require high simulation fidelity to characterize performance.

SEMI’s Serena Brischetto interviews TEL’s Eyal Shekel on how AI-enabled materials informatics can guide the optimization of production processes.

Anika Sunda from Cadence explains how to integrate intelligence into the regression space to increase verification efficiency.

Synopsys’ Brad Bailey examines how to ensure the confidentiality and integrity of SoCs during design and manufacturing.

Jesse Allen

Jesse Allen

(All posts)

Jesse Allen is a Knowledge Center Administrator and Editor at Semiconductor Engineering.